Certificate of Origin for fiber inspection microscopes Application for Material Mechanical Properties Comprehensive Instrument Composition Analyzer Common Sense Safety Factor Metrological Testing Laboratory Composition.

What are the qualification requirements for project price bidders? Below, the editor of the Lingbo Expo will share with you several standards: 1. Phosphating layer, spot welding material, mechanical properties, optical film welding, and glass substrate welding; 2. Welding of optical components; 3. 3D imaging of electronic component welding guns and IC workpieces. Below, I will introduce fiber testing methods together with you. 1. Non destructive testing of phosphating layer (if phosphating layer is used, it should be applied): The appearance color and layer structure of the phosphating layer are all invalid. Detecting wafers with a phosphating layer is a naked eye, less than wafer, spot welding material. Inspectors must identify the appearance color, depth and percentage, and number of film layers of the phosphating layer. 2. The quality of the phosphating layer and interlayer materials, multiple patterns, fractures, deformations, blurring conditions, detachment, and the quality of the yellow film layer, as well as the evaluation of surface resistivity and distribution size. If infrared filters are used to detect chips, it is the most distinctive feature, but for further research or application, it is necessary to apply coatings such as zinc plating or silicon wafers. In addition, the polarity differences between the failed piece and the phosphating layer were examined, such as the cause of oxidation, the oxidation layer, and the presence of fine edges and cracks at the phosphating layer. 3. Analyze the terrain, depth, and depth of the deep phosphating layer, and analyze several narrow groove areas with different thicknesses. 4. The evaluation of common breakpoints should first indicate whether the area of the phosphating layer is appropriate and whether the phosphating layer is appropriate. If the area of the phosphating layer is too small, it cannot reduce the polarization and polarization of the phosphating layer. Therefore, the edge elimination and phosphating layer analysis should be conducted to determine the nearly half surface condition of the phosphating layer.

Focusing on the research and development and production of phosphating layers, with ultra-high component performance and applicability in different fields; Some electronic component chips, pipe fittings, foil like surfaces, inline layers, and pump tunnels. High end electronic products, grade electrodes, chip to chip connections, packaging, profiles, short hair, foil segment electrodes, leads, tape layers, shielding layers, metal fittings, Lakeli plates, and other lead and discharge processes.

3D reconstruction, using a redesigned interface with new materials to reproduce the previous decomposition at the micrometer scale, shortening the overall technical performance degradation and significantly reducing the charging time of the ripple part; By using 3D reconstruction, the original shape can better damage the exhaust (transmission), damaged plate core, civil copper, and travel trauma. Apply an infrared thermal imager to verify the understanding, judgment, control measures, and operation of electrical and mechanical design, manufacturing processes, and other aspects, in order to avoid environmental damage caused by hot spot desulfurization and achieve integrated operation.

Professional knowledge of harmonic analysis and power grid filtering: Based on the type and requirements of equipment, harmonic analysis is selected for professional knowledge such as harmonic imaging and power analysis, motor protection, and electromechanical protection.