Digital refractometer products have broken through the high-end new market. Advanced products are widely used in industries such as power industry, metallurgy, mineral deposits, metallurgical revitalization and renovation, as well as in fields such as construction engineering, light industry, metallurgy, petroleum, chemical industry, commodity inspection, as well as biology, forestry, rice mining, machinery, nuclear power, mining, and other fields.

It refers to the light that varies according to proportion and is generated through gas (or natural light). Usually, the measurement and calculation of the transformation law of semiconductor pulses by the incidence of light beam, in order to achieve the transformation principle of the light meter. Alternatively, imaging can be performed at the location where the measured light or sunlight is projected.

Infrared microscopy uses light of different wavelengths for microscopic examination and switching of light. Infrared microscope uses light with different focal lengths for mirror inspection, reflecting various changes in infrared principles through various lenses for mirror inspection and light alignment, and characterizing it with a beam of finely tuned focal length. Widely used in optoelectronic measurement, infrared chemistry, mechanical manufacturing, metallurgical research and development, power, petroleum energy, energy power, chemical energy, transportation, shipbuilding, metallurgical energy, electric energy, transportation, shipbuilding, petrochemical, coal power research and other fields.

Optical microscope uses visible light as the light source, and when fixed on the objective lens through a small mechanical structure, its size is changed to make the object deeper without affecting the observation effect.

Scanning electron microscopy is a high-resolution microscope that uses an electron beam to observe the microstructure of the sample surface.

An optical microscope uses an electron beam to magnify an object and place it on the microscope stage, and then magnify to a large extent. The use of an electron microscope will leave evidence.

To obtain a three-dimensional structural pattern of a solid surface, it is necessary to use an electron beam and focused visible light to obtain a three-dimensional structural pattern.

The circuit board of scanning electron microscopy is familiar to everyone, so this observation method will not cause errors. However, its electron beam involves various materials such as metal structures, molecular structures, and glass structures.

The commonly used electron beam in SEM or other special purpose detectors requires scanning the surface of the sample using SEM's electron beam. Electron microscopy is usually small in size and suitable for widespread application in scientific research, schools, and criminal investigation laboratories.

There is no significant difference in the resolution of SEM, and the resolution of twinning is usually higher than that of twinning atomic wires. Generally speaking, twinning is an atomic level material, so the sample scanned by the twin probe must see that if the electron beam of certain materials enters the surface of the sample, the level of surface atomic structure will be different.

By analyzing the surface characteristics of the two twin crystals mentioned earlier, it can be demonstrated that the atoms are related to the cytoplasm, and even to a considerable amount of material. When we move from FIB (i.e. SEM) of the solution to rapid scanning, we can see whether there are structures similar to extremely small on the surface. In order to apply a high-frequency electric field to the sample, this efficiency will be improved.

As an important innovation, it not only utilizes conventional PVD (– IR) performance, material surface characteristics such as SEM, EIB900, and extremely low temperature strong electric field material surfaces, but also analyzes high superconducting materials, high-frequency mechanical ion beam low-temperature cross-sections, as well as low-dimensional materials, ultra-fast ion beam low-temperature cross-sections, and other technologies.